Our paper "Full Wafer Redistribution and Wafer Embedding as Key Technologies for a Multi-Scale Neuromorphic Hardware Cluster" won the Best Academic Paper Award on Electronic Packaging Technology Conference.
The paper emerged in a the collaboration between the Fraunhofer Institute for Reliability and Microintegration in Berlin and the Electronic Vision(s) group.
It depicts the redistribution layers used for the current neuromorphic hardware system BrainScaleS-1. Furthermore, the embedding of a silicon wafer into a printed circuit board is explained.
Last update of this page: 2018-09-20 by Maurice Güttler
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