The second version of an embedded HICANN wafer arrived on the 5th of July.
This new prototype has compared to the last board additional vias connecting the bottom copper layer with the back of the silicon wafer. These vias should improve the heat dissipation from the wafer away.
The board was produced at the Fraunhofer Institute for Reliability and Microintegration in Berlin. ( IZM-Homepage )
Last update of this page: 2018-07-24 by Maurice Güttler
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